ThermoBond Cir-Kits, Combo SMT / Thru-Hole Kit

Terms and Definitions

Process Guides that cover specific component applications for assembly, rework and repair. These are searchable by installation/removal, component type, and handpiece or system used.

A Selection for Mixed Technology Repairs

Complete Consisting of:

ThermoBond Frames (tin plated on one side):

Chip Resistor/Capacitor 1200-0147-01
SOICs, TSOPs 1200-0150-01
PLCCs, LCCCs, SOJs, Ceramic QFPs, Basic Cir-Kit Material and Dry Film Adhesive for Custom Shaping/Cutting 1200-0151-01
Straight Run 1200-0158-01
Fine Traces 1200-0159-01
Track Pad 1200-0161-01

Lap/Trace Frames (tin plated on both sides):

Fine Traces 1200-0165-01

Other Accessories:

Eyelets and Funnelets (#"s 4, 5, 6, 8, 10)
Abrasive Stick, 1 piece
Kapton Tape, 12.7mm (0.5") x 76.2mm (3.0"), 10 pieces
Fine Angled Tweezers 1100-0043-P1
Cutting Board 1143-0009
Upper Setting Tool 6000-0051
Setting Tool Guide 6000-0054
Lower Setting Tool, Funnelet 1132-0017-P1
Support Tool Base 1321-0054
Provise Kit (for cutting and scraping) 7016-0003-P1
ThermoBond Tips

120 V Part #: 6993-0180      NSN: 5999-01-446-1919
230 V Part #: 6993-0180      NSN: 5999-01-446-1919
  • Frame Material 1 oz copper foil
  • Dry Film Adhesive.04mm Thick (0.0015" Thick)
  • Protective Backing.08mm Thick (0.003" Thick)
  • Bonding Time 15 Seconds
  • Binding Temperature315°C (600°F) nominal
  • EyeletsOver 25 different Thru-Hole Eyelet sizes are available
  • PlatingAll ThermoBond frames come standard with 0.025mm (0.001") Tin plated on one side



Process Guides